Key Features - Compute Intensive Application - HPC, Data Center - Enterprise Server - Financial Analysis - Mission-critical applications Four hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following:1. Dual socket P (LGA 3647) supports Intel® Xeon® Scalable Processors, Dual UPI up to 10.4GT/s2. Up to 2TB EC..

Key Features - HPC - Data Center - Enterprise Server - Finanical Analysis - Mission-critical applications Four hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following:1. Dual socket P (LGA 3647) supports Intel® Xeon® Scalable Processors, Dual UPI up to 10.4GT/s2. Up to 1TB ECC 3DS LRDIMM, up to DDR4-2666MH..

- Compute Intensive Applications - HPC, Data Center, Enterprise Server - Hyperscale / Hyperconverged Four hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following: 1. Single AMD EPYC™ 7002 Series Processor 2. Up to 2TB ECC 3DS LRDIMM, up to DDR4-3200MHz; 8 DIMM slots 3. 2 PCI-E 4.0 x16 (LP) slot; 1 SIOM card suppo..

MicroCloud A+ Server AS -3015MR-H8TNR Key Applications Cloud Computing, Web/Collocation Services, Web Cache, CDN, Video Streaming, Social Networking, Downloads, Corporate - WINS, DNS, Print, Login, Key Features 8 sets of AMD EPYCTM 4004 Series Processor; AMD Knoll - Integrated I/O Controller Hub; 8 set of Up to 128GB ECC/non ECC UDIMM; DDR5 ..

1. Dual socket P (LGA 3647) supports Intel® Xeon® Scalable Processors, 3 UPI up to 10.4GT/s 2. Up to 2TB ECC 3DS LRDIMM, up to DDR4-2666MHz; 16 DIMM slots 3. 3 PCI-E 3.0 x16, 4 PCI-E 3.0 x8 (slot 2 & 3 occupied by controller and JBOD expansion port) 4. 16 Hot-swap 3.5" SAS3/SATA3 direct attached drive bays 5. Broadcom 3108 SAS3 AOC ..

Key Features - Corporate Database - Database Processing & Storage - Enterprise Server - HPC, Data Center - iSCSI SAN 1. Dual socket P (LGA 3647) supports Intel® Xeon® Scalable Processors, 3 UPI up to 10.4GT/s2. Up to 2TB ECC 3DS LRDIMM, up to DDR4-2666MHz; 16 DIMM slots3. 3 PCI-E 3.0 x16, 4 PCI-E 3.0 x8 (slot 2 & 3 occupied by cont..

1. Single socket H4 (LGA 1151) supports Intel® Xeon® processor E3-1200 v5, Intel® 6th Gen. Core™ i3 series, Intel® Celeron® and Intel® Pentium® 2. 2x 3.5" SATA3 by default; 2x 2.5" SATA3 HDDs w/ Optional kits 3. Up to 64GB ECC UDIMM DDR4-2133MHz in 4 sockets 4. 2 GbE LAN ports via Intel i350, 1 dedicated LAN for IPMI Remote Managem..

Two hot-pluggable systems (nodes) in a 3U form factor. 1. High Availability Storage Appliance Platform 2. Redundant Hot-swap expander trays 3. 4 SAS3.0 IO ports 4. 16 Hot-swap 3.5" Drive Bays 5. IPMI 2.0 with dedicated LAN 6. 12x 40mm cooling fans 7. 1200W Redundant Power Supplies Titanium Level Certified..

Key Features• Backup Storage, Cold Storage • Database Applications • Data Warehousing, Archiving 1. Single socket P (LGA 3647) supports Intel® Xeon® Scalable Processors2. Up to 1TB ECC 3DS LRDIMM, up to DDR4-2666MHz; 8 DIMM slots 3. 2 PCI-E 3.0 x8 (in x16), 3 PCI-E 3.0 x8, 1 PCI-E 3.0 x4 (in x8) 1 PCI-E 3.0 x8 (occupied by HBA)4. 2 GbE..

Key Features• Backup Storage, Cold Storage • Database Applications • Data Warehousing, Archiving1. Single socket P (LGA 3647) supports Intel® Xeon® Scalable Processors2. Up to 1TB ECC 3DS LRDIMM, up to DDR4-2666MHz; 8 DIMM slots3. 2 PCI-E 3.0 x8 (in x16), 3 PCI-E 3.0 x8, 1 PCI-E 3.0 x4 (in x8) 1 PCI-E 3.0 x8 (occupied by HBA)4. 2 GbE LAN ..

1. Single socket P (LGA 3647) supports Intel® Xeon® Scalable Processors, Dual UPI up to 10.4GT/s 2. Up to 1TB ECC 3DS LRDIMM, up to DDR4-2666MHz; 8 DIMM slots 3. 1 PCI-E 3.0 x16, 1 PCI-E 3.0 x8, 1 PCI-E 3.0 x8, 1 PCI-E 3.0 x4 (in x8) 4. 2x 10GBase-T with Intel® X557 5. 36 Hot-swap 3.5" SAS/SATA drive bays with SES3 (24 front + 12 rear..

1. Dual socket P (LGA 3647) supports Intel® Xeon® Scalable Processors, 3 UPI up to 10.4GT/s 2. Up to 2TB ECC 3DS LRDIMM, up to DDR4-2666MHz; 16 DIMM slots 3. 3 PCI-E 3.0 x16, 4 PCI-E 3.0 x8 (slot 2 & 3 occupied by controller and JBOD expansion port) 4. 24 Hot-swap 3.5" SAS3/SATA3 direct attached drive bays 5. Broadcom 3108 SAS3 AOC ..

1. Dual socket P (LGA 3647) supports Intel® Xeon® Scalable Processors, 3 UPI up to 10.4GT/s 2. Up to 2TB ECC 3DS LRDIMM, up to DDR4-2666MHz; 16 DIMM slots 3. 3 PCI-E 3.0 x16, 4 PCI-E 3.0 x8 (slot 2 & 3 occupied by controller and JBOD expansion port) 4. 24 Hot-swap 3.5" SAS3/SATA3 direct attached drive bays 5. Broadcom 3008 SAS3 AOC ..

1. Dual socket P (LGA 3647) supports Intel® Xeon® Scalable Processors, 3 UPI up to 10.4GT/s 2. Up to 2TB ECC 3DS LRDIMM, up to DDR4-2666MHz; 16 DIMM slots 3. 3 PCI-E 3.0 x16, 4 PCI-E 3.0 x8 (slot 2 & 3 occupied by controller and JBOD expansion port) 4. 36 Hot-swap 3.5" SAS3/SATA3 direct attached drive bays 5. Broadcom 3108 SAS3 AOC ..

1. Dual socket P (LGA 3647) supports Intel® Xeon® Scalable Processors, 3 UPI up to 10.4GT/s 2. Up to 2TB ECC 3DS LRDIMM, up to DDR4-2666MHz; 16 DIMM slots 3. 3 PCI-E 3.0 x16, 4 PCI-E 3.0 x8 (slot 2 & 3 occupied by controller and JBOD expansion port) 4. 36 Hot-swap 3.5" SAS3/SATA3 direct attached drive bays 5. Broadcom 3008 SAS3 AOC ..